|
| 基于SEM的MLCC端电极焊接失效分析 |
| Analysis on Welding Failure of Terminal Electrode of Multilayer Ceramic Capacitors by SEM |
| |
| DOI： |
| 中文关键词: 锡镀层 微观结构 氧化 |
| 英文关键词:MLCC |
| 基金项目: |
| 庄立波 包生祥 汪蓉 张琳 |
庄立波,包生祥,ZHUANG Li-bo,BAO Sheng-xiang(电子科技大学,电子薄膜与集成器件国家重点实验室,四川,成都,610054)
;汪蓉,张琳,WANG Rong,ZHANG Lin(成都宏明电子科大,新材料有限公司,四川,成都,610058)
? |
| 摘要点击次数: 1333 |
| 全文下载次数: 270 |
| 中文摘要: |
| 针对多层陶瓷电容器端电极锡镀层的可焊性失效问题,运用扫描电子显微镜(SEM)分析了锡镀层的微观结构,并用能谱仪对其进行成分分析,找出了失效的主要原因:可焊性变差样品的端电极表面锡镀层出现因氧化产生的异常区域,以至于器件的可焊性变差.并通过后期的可焊性实验验证了分析的结果,找出了端电极焊接失效的原因,并提出了应对端电极氧化问题的改进措施.根据分析提出了改进意见,较好地解决了器件的焊接失效问题. |
| 英文摘要: |
| Aimed at the problem of welding failure of tin-coating in multilayer ceramic capacitors devices,we studied the microstructure and components of tin-coating with SEM and EDS.The welding failure modes occurred in the outer-electrode are demonstrated and the reason of failure are discussed.The results show that some abnormal regions on the tin-coating of samples with welding problem are produced by oxidation.The strict solderability test has verified the results of the analysis and according to the analysis im... |
| HTML 查看全文 查看/发表评论 下载PDF阅读器 |
|
|
|